IEEE Transactions on Components, Packaging, and Manufacturing covers the following content areas: modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.Membership in IEEE's technical societies provides access to top quality publications such as this one either as a member benefit or via discounted subscriptions. The electronic version of this journal is part of the CPMT Society membership, but all media types are also offered for purchase.

IEEE關(guān)于組件、封裝和制造的交易涵蓋了以下內(nèi)容領(lǐng)域：建模、設(shè)計(jì)、構(gòu)建模塊、技術(shù)基礎(chǔ)設(shè)施和支持電子、光子和MEMS封裝的分析，以及無(wú)源組件、電氣觸點(diǎn)和連接器、熱管理和設(shè)備可靠性方面的新發(fā)展；以及電子零件和總成的制造，具有廣泛的設(shè)計(jì)、工廠建模、裝配方法、質(zhì)量、產(chǎn)品魯棒性和環(huán)境設(shè)計(jì)。IEEE技術(shù)協(xié)會(huì)的會(huì)員資格提供了訪問(wèn)頂級(jí)出版物的機(jī)會(huì)，如作為會(huì)員利益或通過(guò)折扣訂閱。該雜志的電子版是CPMT協(xié)會(huì)會(huì)員的一部分，但也提供所有媒體類(lèi)型的購(gòu)買(mǎi)。